Ortus 1100

Substrate holder: Dome ø995 mm, Planetary 4x ø387 mm. Automatic Optical Monitoring. 2xE-gun, 2XResistance evap., RF Plasma Assist Source.

For production companies in the need of higher production capacities.
Suitable for coatings on 3D shaped substrates.

For detailed information about our ORTUS PIAD coater portfolio and its coating capabilities please download the ORTUS CATALOGUE.

Configuration options:

1. Substrate holder

	size	loading cap. of 1" for reff.	Thickness U% for all loading area	Max single substrate size
Dome type	ø995 mm	576	±2%	380 mm
Planetary	4 x ø387 mm	416	±1%	387 mm

2. Technological devices

Electron Beam Evaporation (EBE)
- 3 different sizes EV M-6, EV M-8, EV M-10
- Customized crucibles, 1 ... 12 pockets
- Max. quantity : 2 pcs
Cleaning and Assistance sources
- Accelerator with anode Layer (Ion Current Density up to 4.2 mA/cm^2)
- Copra: RF Plasma Assist Source (Ion Current Density up to 2.5 mA/cm^2)
- Max. quantity : 1 pcs
Resistance evaporation source
- Max. quantity : 2 pcs together with 2 EBE

3. Coating process control

Rate and thickness control system (quartz control)
Optical process monitoring system OCP
- OCP Singlewave for monochromatic monitoring

4. Accessories

Substrate heating system
- IR lamps
- Tubular heater

Exampes of substrate holders for semispherical substrates

Ortus

Ortus 700

Substrate holder:
Dome ø620 mm,
Planetary 3x ø250 mm.
Automatic Optical Monitoring.
2xE-gun, Resistance evap., End hall assist, RF Plasma Assist Source.

Ortus 900

Substrate holder:
Dome ø800 mm,
Planetary 4x ø327 mm.
Automatic Optical Monitoring.
2xE-gun, Resistance evap., End hall assist, RF Plasma Assist Source.

Ortus 1500

Substrate holder:
Dome ø1390 mm,
Planetary 4x ø590 mm.
Automatic Optical Monitoring.
2xE-gun, 2xResistance evap., RF Plasma Assist Source.

OEM components

OCP SingleWave

Deposition process monitoring at the selected wavelengths

Linear anode layer accelerators

Technology

Plasma Ion Assisted Deposition (PIAD)

Plasma Ion Assisted Deposition (PIAD) is a technology that combines ion/plasma treatment with electron beam evaporation (or other PVD methods) to modify film growing dinamics and to get desired film properties which are impossible to achieve by conventional PVD methods. It is used to deposit conformal optical coatings with high densities on complex surfaces, hard coatings of compound materials, and adherent metal coatings.