Magnetron sputtering is a technology for thin film depositing in a vacuum chamber and in a working gas using cathode sputtering of the target material in crossed electric and magnetic fields.
Electrically conductive materials, such as conductors and semiconductors, are used as targets in medium-frequency DC and AC magnetrons. The use of magnetic materials is limited by the thickness of the target and requires the use of a special magnetic system. For the sputtering of dielectric materials, the HF version of the magnetron is used, which also requires an HF generator and a matching unit tuned to the applied discharge system.

Application:
Cylindrical stationary magnetrons are used in vacuum installations of periodic operation with substrate sizes up to 3 meters or more. Such magnetrons are especially in demand in vacuum equipment for the bulk deposition of coatings in the space around a stationary cylindrical target.

Main tasks:

• Functional layers deposition inside closed volume or tube often used as conductive coatings;
• Source of electrons for ion-beam source

Technical data: