Ortus 1500

Substrate holder: Dome ø1390 mm, Planetary 4x ø590 mm. Automatic Optical Monitoring. 2xE-gun, 2xResistance evap., RF Plasma Assist Source.

The biggest ORTUS with the highest loading capacity.

Distinguishing features:

suitable for coating on large 3D shapes substrates
suitable low temperature evaporation for coating on plastic substrates

Configuration options:

1. Substrate holder

	size	loading cap. of 1" for reff.	Thickness U% for all loading area	Max single substrate size
Dome type	ø1390 mm	1075	±2%	580 mm
Planetary	4 x ø590 mm	850	±1%	590 mm

2. Technological devices

Electron Beam Evaporation (EBE)
- 3 different sizes EV M-6, EV M-8, EV M-10
- Customized crucibles, 1 ... 12 pockets
- Max. quantity : 2 pcs
Cleaning and Assistance sources
- Accelerator with anode Layer (Ion Current Density up to 4.2 mA/cm^2
- Copra: RF Plasma Assist Source (Ion Current Density up to 2.5 mA/cm^2)
- Max. quantity : 1
Resistance evaporation source
- Max. quantity : 2 pcs together with 2 EBE

3. Coating process control

Rate and thickness control system (quartz control)
Optical process monitoring system OCP
- OCP Singlewave for monochromatic monitoring

4. Accessories

Substrate heating system
- IR lamps
- Tubular heater

Ortus

Ortus 700

Substrate holder:
Dome ø620 mm,
Planetary 3x ø250 mm.
Automatic Optical Monitoring.
2xE-gun, Resistance evap., End hall assist, RF Plasma Assist Source.

Ortus 900

Substrate holder:
Dome ø800 mm,
Planetary 4x ø327 mm.
Automatic Optical Monitoring.
2xE-gun, Resistance evap., End hall assist, RF Plasma Assist Source.

Ortus 1100

Substrate holder:
Dome ø995 mm,
Planetary 4x ø387 mm.
Automatic Optical Monitoring.
2xE-gun, 2XResistance evap., RF Plasma Assist Source.

OEM components

OCP SingleWave

Deposition process monitoring at the selected wavelengths

Linear anode layer accelerators

Technology

Plasma Ion Assisted Deposition (PIAD)

Plasma Ion Assisted Deposition (PIAD) is a technology that combines ion/plasma treatment with electron beam evaporation (or other PVD methods) to modify film growing dinamics and to get desired film properties which are impossible to achieve by conventional PVD methods. It is used to deposit conformal optical coatings with high densities on complex surfaces, hard coatings of compound materials, and adherent metal coatings.