Cylindrical rotary magnetrons

Cylindrical rotary magnetrons

Used in a vacuum equipment of periodic and continuous operation with substrate sizes up to 3 meters or more

Magnetron sputtering is a technology for thin films depositing in a vacuum chamber and in a working gas using cathode sputtering of the target material in crossed electric and magnetic fields.
Electrically conductive materials, such as conductors and semiconductors, are used as targets in medium-frequency DC and AC magnetrons. The use of magnetic materials is limited by the thickness of the target and requires the use of a special magnetic system. For the sputtering of dielectric materials, the HF version of the magnetron is used, which also requires an HF generator and a matching unit tuned to the applied discharge system.

Cylindrical rotary magnetrons are used in a vacuum equipment of periodic and continuous operation with substrate sizes up to 3 meters or more. Such magnetrons are especially in demand in vacuum equipment for serial and mass production, where there are important such parameters as target lifetime and long-term stability of coating processes.

Main tasks:
- deposition of functional coatings in the production of displays, the production of energy-saving, electrochromic architectural glasses, solar cells, etc.;
- deposition of functional coatings: optical, conductive, protective, dielectric, metallization of the surface of plastic and glass products, etc.

Technical data:

Parameters Basic Options
Magnetron type Cylindrical rotary
Working pressure 0,2 ÷ 2 Pa
Target material non-magnetic, electrically conductive materials and semiconductors (Si, Ge, etc.) magnetic materials, dielectrics
Target width from 145 to 180 by request
Target length by request
Magnetic system Permanent magnets NdFeB+2xNi
Gas distributor No Yes
Anode No magnetized hidden, etc.

Target cooling

Power supply DC, DC-pulse, MF-AC RF, HiPIMS
Specific maximum power DC/DC-pulse/MF-AC <20 kW/cm <50 kW/cm
Specific maximum power RF <5 kW/cm <15 kW/cm
Target utilization >80% >80%
Gas flow (depends on pumping) 50…750 cm3/min
Mean time between maintenance (mtbm) 144 h
Cooling water
Cooling water temperature 18...25 °C
Water pressure 2..4 bar
Water flow >0,7 l/min/kW
Working gas Ar, O2 and other
Working gas purity 99,99 %