Magnetron sputtering is a technology for the deposition of thin films in a vacuum chamber and in a working gas environment using cathode sputtering of the target material in a crossed electric and magnetic field set up.
Electrically conductive materials, such as conductors and semiconductors, can be  used as target materials in a medium-frequency DC and AC magnetron set-up. The use of magnetic materials is limited by the thickness of the target and requires the use of a special magnetic system. For the sputtering of dielectric materials, DC -pulsed powered or  AC  powered or RF powered  magnetron sputtering processes need to be used. The RF version requires an rf generator and a rf  matching load tuned to the applied discharge system.

Application:
Round magnetrons are used in vacuum lab and batch equipment with substrate sizes up to 250 mm.

Main applications:

• Production of optical, semiconductor devices, thin-film hybrid integrated circuits, piezoelectric products, acoustoelectronics;
• Deposition of functional coatings: optical, conductive, protective, dielectric, metalisation of the surface of plastic and glass products, etc;
• Source of electrons for ion-beam source.

Technical data: