Magnetron sputtering is a technology for thin films depositing in a vacuum chamber and in a working gas using cathode sputtering of the target material in crossed electric and magnetic fields.
Electrically conductive materials, such as conductors and semiconductors, are used as targets in medium-frequency DC and AC magnetrons. The use of magnetic materials is limited by the thickness of the target and requires the use of a special magnetic system. For the sputtering of dielectric materials, the HF version of the magnetron is used, which also requires an HF generator and a matching unit tuned to the applied discharge system.

Applacation:
Rectangular magnetrons are used in vacuum installations of periodic and continuous operation with substrate sizes up to 3 meters or more.

Main tasks:

• Production of optical, semiconductor devices, thin-film hybrid integrated circuits, piezoelectric products, acoustoelectronics;
• Deposition of functional coatings: optical, conductive, protective, dielectric, metallization of the surface of plastic and glass products, etc;
• Source of electrons for ion-beam source.

Technical data: