The deposition is carried out by magnetron sputtering with preliminary ion-beam cleaning. The coatings are deposited on substrates installed on a substrate holder of the disk type
TECHNOLOGICAL DEVICES :
- Ion-beam cleaning source
- DC-magnetron
- Pulse-DC magnetron
- RF- magnetron
| Maximum substrate diameter | 200 mm |
| Maximum coating thickness uniformity | ± 3,0% |
| Ultimate residual pressure in the clean technological vacuum chamber | 5×10-4 Pa |
| Coatings control | Quartz system for thickness control Control by time |
