RF-Plasma sources / Gridded ion beam sources flow
Application:
RF plasma sources are intended to create and sustain a dense, low energetic plasma or mono-energetic ion flow with high homogeneity in vacuum process systems.
Main application:
- anisotropic etching of sub micron structures in resist in microelectronics production;
- plasma chemical deposition of non-defect functional dielectric films in semiconductor and hybrid microelectronics production;
- synthesis of polymeric coatings and new materials;
- mass-spectrometer analysis with inductive-coupled plasma;
- dielectric surface modification for applying new properties (like hydrophilicity).
Description:
Inductively coupled plasma (ICP) RF discharge is excited by a current flowing through a water-cooled inductor (antenna). RF power applied to the inductor creates a vortex electrical field in the vacuum chamber, which ensures the generation of plasma. In a low-pressure inductively coupled high-frequency discharge, the power of the high-frequency generator is distributed between the active resistance of the external circuit and the plasma, and the power enters the plasma through two channels: inductive, which exists due to the current flowing through the inductor (antenna), and capacitive, due to the presence of capacitive coupling between the antenna and plasma.
RF source is a plane (planar) or cylindrical system of electrodeless RF inductive discharge. A grid can be applied for the extraction (pulling out) of the ions of increasing the ion energy.
Technical data:
| Parameters | Basic | Options |
| Source type | RF source of inductively coupled plasma | |
| Working pressure | 0,05 ÷ 100 Pa | |
| Cylindrical antenna diameter | 80, 120, 160, 180, 210 | by request |
| Antenna location | on atm | by request |
| Planar antenna diameter | 100, 200 | by request |
| Grid material (if available) | Mo, Ti | by request |
| Power supply | RF (13,56MHz) | by request |
| Ion current density on the substrate | < 7 mA/cm2 | |
| Max. power | < 3000W | |
| Gas flow (depends on pumping out and dimensions of the working chamber) | 5…50 sccm | |
| Cooling | inductor: running water, discharge chamber of a cylindrical antenna: forced air | |
| Water temperature | 18...25 ℃ | |
| Water flow | > 0,7 l/min/kW | |
| Working gas | Ar, O2 and other | |
| Gas purity | 99.99 % | |
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Plasma generator with planar antenna model: ICP-P200 |
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Plasma generator with cylindrical antenna, matching load and grid ion optics dia. 80mm, convergent or divergent with defined focal length model:GIBS-80-Con(Div) -/+{Focus} & AMIL-3000 |
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Plasma generator with cylindrical antenna and grid ion optics dia.120mm, convergent or divergent with defined focal length model:GIBS-120-Con(Div) -/+{Focus} |
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RF neutralizer and matching load model: RFN-1 & AMIL-100 |
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